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dc.contributor.advisorBayındır, Mehmet
dc.contributor.authorŞenlik, Özlem
dc.date.accessioned2016-01-08T18:07:28Z
dc.date.available2016-01-08T18:07:28Z
dc.date.issued2008
dc.identifier.urihttp://hdl.handle.net/11693/14754
dc.descriptionAnkara : The Program of Materials Science and Nanotechnology and the Institute of Engineering and Sciences of Bilkent University, 2008.en_US
dc.descriptionThesis (Master's) -- Bilkent University, 2008.en_US
dc.descriptionIncludes bibliographical references leaves 65-69.en_US
dc.description.abstractThe recent advent of micro and nano devices increased the interest in small scale material properties, such as elasticity, conductivity or heat capacity, which are considerably different from their bulk counterparts due to, primarily, increasing surface to volume ratios. These novel properties must be analyzed by using ultra-sensitive devices since characterization of these properties is not possible with conventional probing instrumentation due to their large mass or volume which decreases signal to noise ratio. Microelectromechanical systems (MEMS) with short response time and high sensitivity are suitable for such measurements, such as very small mass detection (zeptograms) and calorimetry of small volume materials (yoctocalories). In this thesis a MEMS cantilever was used for thermomechanical characterization of thin film amorphous semiconductors. 100 nm thick As2S3 and Ge-As-Se-Te glasses were thermally evaporated onto a bilayer microcantilever. The microcantilever was deflected and vibrated by electrothermal actuation. By monitoring deflection, amplitude and phase of the cantilever oscillation, multiple glass transition and melting points were identified; the effects of the variation of thermal expansion coefficients (CTE), reversible and irreversible heat capacities and Young’s modulus of the thin film samples were observed simultaneously. Hence the possibility of the integration of calorimetry, thermomechanical analysis (TMA) and dynamical mechanical thermal analysis (DMTA) in a single MEMS device was demonstrateen_US
dc.description.statementofresponsibilityŞenlik, Özlemen_US
dc.format.extentxiii, 69 leaves, illustrations, graphsen_US
dc.language.isoEnglishen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectNanocalorimetryen_US
dc.subjectThin Filmsen_US
dc.subjectElectroThermal Actuationen_US
dc.subjectMEMS/NEMSen_US
dc.subjectThermal Methodsen_US
dc.subject.lccTA418.9.N35 S453 2008en_US
dc.subject.lcshNanostructured materials--Thermal properties.en_US
dc.subject.lcshMicroelectronics--Thermal properties.en_US
dc.subject.lcshThermal analysis.en_US
dc.subject.lcshCalorimetry.en_US
dc.subject.lcshThin films.en_US
dc.titleMicro and nanostructured devices for thermal analysisen_US
dc.typeThesisen_US
dc.departmentGraduate Program in Materials Science and Nanotechnologyen_US
dc.publisherBilkent Universityen_US
dc.description.degreeM.S.en_US


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