dc.contributor.advisor | Bayındır, Mehmet | |
dc.contributor.author | Şenlik, Özlem | |
dc.date.accessioned | 2016-01-08T18:07:28Z | |
dc.date.available | 2016-01-08T18:07:28Z | |
dc.date.issued | 2008 | |
dc.identifier.uri | http://hdl.handle.net/11693/14754 | |
dc.description | Ankara : The Program of Materials Science and Nanotechnology and the Institute of Engineering and Sciences of Bilkent University, 2008. | en_US |
dc.description | Thesis (Master's) -- Bilkent University, 2008. | en_US |
dc.description | Includes bibliographical references leaves 65-69. | en_US |
dc.description.abstract | The recent advent of micro and nano devices increased the interest in small scale
material properties, such as elasticity, conductivity or heat capacity, which are
considerably different from their bulk counterparts due to, primarily, increasing
surface to volume ratios. These novel properties must be analyzed by using
ultra-sensitive devices since characterization of these properties is not possible
with conventional probing instrumentation due to their large mass or volume
which decreases signal to noise ratio. Microelectromechanical systems (MEMS)
with short response time and high sensitivity are suitable for such
measurements, such as very small mass detection (zeptograms) and calorimetry
of small volume materials (yoctocalories).
In this thesis a MEMS cantilever was used for thermomechanical
characterization of thin film amorphous semiconductors. 100 nm thick As2S3
and Ge-As-Se-Te glasses were thermally evaporated onto a bilayer
microcantilever. The microcantilever was deflected and vibrated by
electrothermal actuation. By monitoring deflection, amplitude and phase of the
cantilever oscillation, multiple glass transition and melting points were
identified; the effects of the variation of thermal expansion coefficients (CTE),
reversible and irreversible heat capacities and Young’s modulus of the thin film
samples were observed simultaneously. Hence the possibility of the integration of calorimetry, thermomechanical analysis (TMA) and dynamical mechanical
thermal analysis (DMTA) in a single MEMS device was demonstrate | en_US |
dc.description.statementofresponsibility | Şenlik, Özlem | en_US |
dc.format.extent | xiii, 69 leaves, illustrations, graphs | en_US |
dc.language.iso | English | en_US |
dc.rights | info:eu-repo/semantics/openAccess | en_US |
dc.subject | Nanocalorimetry | en_US |
dc.subject | Thin Films | en_US |
dc.subject | ElectroThermal Actuation | en_US |
dc.subject | MEMS/NEMS | en_US |
dc.subject | Thermal Methods | en_US |
dc.subject.lcc | TA418.9.N35 S453 2008 | en_US |
dc.subject.lcsh | Nanostructured materials--Thermal properties. | en_US |
dc.subject.lcsh | Microelectronics--Thermal properties. | en_US |
dc.subject.lcsh | Thermal analysis. | en_US |
dc.subject.lcsh | Calorimetry. | en_US |
dc.subject.lcsh | Thin films. | en_US |
dc.title | Micro and nanostructured devices for thermal analysis | en_US |
dc.type | Thesis | en_US |
dc.department | Graduate Program in Materials Science and Nanotechnology | en_US |
dc.publisher | Bilkent University | en_US |
dc.description.degree | M.S. | en_US |