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dc.contributor.authorÖzaktaş, Haldun M.
dc.contributor.authorErden, M. F.
dc.date.accessioned2015-07-28T11:56:56Z
dc.date.available2015-07-28T11:56:56Z
dc.date.issued1999-12-10en_US
dc.identifier.issn0003-6935
dc.identifier.urihttp://hdl.handle.net/11693/11129
dc.description.abstractSeveral approaches to three-dimensional integration of conventional electronic circuits have been pursued recently. To determine whether the advantages of optical interconnections are negated by these advances, we compare the limitations of fully three-dimensional systems interconnected with optical, normally conducting, repeatered normally conducting, and superconducting interconnections by showing how system-level parameters such as signal delay, bandwidth, and number of computing elements are related. In particular, we show that the duty ratio of pulses transmitted on terminated transmission lines is an important optimization parameter that can be used to trade off signal delay and bandwidth so as to optimize applicable measures of performance or cost, such as minimum message delay in parallel computation.en_US
dc.language.isoEnglishen_US
dc.source.titleApplied Opticsen_US
dc.relation.isversionofhttp://dx.doi.org/10.1364/AO.38.007264en_US
dc.subjectOptimal foundation architectureen_US
dc.subjectSystem sizeen_US
dc.subjectSiliconen_US
dc.subjectGrowthen_US
dc.titleComparison of fully three-dimensional optical, normally conducting, and superconducting interconnectionsen_US
dc.typeArticleen_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.citation.spage7264en_US
dc.citation.epage7275en_US
dc.citation.volumeNumber38en_US
dc.citation.issueNumber35en_US
dc.identifier.doi10.1364/AO.38.007264en_US
dc.publisherOptical Society of Americaen_US
dc.contributor.bilkentauthorHaldun M. Özaktaş


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