Browsing by Subject "III-Nitride"
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Item Open Access Atomic layer deposition: an enabling technology for the growth of functional nanoscale semiconductors(Institute of Physics Publishing, 2017) Bıyıklı, Necmi; Haider A.In this paper, we present the progress in the growth of nanoscale semiconductors grown via atomic layer deposition (ALD). After the adoption by semiconductor chip industry, ALD became a widespread tool to grow functional films and conformal ultra-thin coatings for various applications. Based on self-limiting and ligand-exchange-based surface reactions, ALD enabled the low-temperature growth of nanoscale dielectric, metal, and semiconductor materials. Being able to deposit wafer-scale uniform semiconductor films at relatively low-temperatures, with sub-monolayer thickness control and ultimate conformality, makes ALD attractive for semiconductor device applications. Towards this end, precursors and low-temperature growth recipes are developed to deposit crystalline thin films for compound and elemental semiconductors. Conventional thermal ALD as well as plasma-assisted and radical-enhanced techniques have been exploited to achieve device-compatible film quality. Metal-oxides, III-nitrides, sulfides, and selenides are among the most popular semiconductor material families studied via ALD technology. Besides thin films, ALD can grow nanostructured semiconductors as well using either template-assisted growth methods or bottom-up controlled nucleation mechanisms. Among the demonstrated semiconductor nanostructures are nanoparticles, nano/quantum-dots, nanowires, nanotubes, nanofibers, nanopillars, hollow and core-shell versions of the afore-mentioned nanostructures, and 2D materials including transition metal dichalcogenides and graphene. ALD-grown nanoscale semiconductor materials find applications in a vast amount of applications including functional coatings, catalysis and photocatalysis, renewable energy conversion and storage, chemical sensing, opto-electronics, and flexible electronics. In this review, we give an overview of the current state-of-the-art in ALD-based nanoscale semiconductor research including the already demonstrated and future applications.Item Open Access High-performance AlxGA1-xN-Based UV photodetectors for visible/solar-blind applications(Bilkent University, 2004) Bıyıklı, NecmiHigh-performance detection of ultraviolet (UV) radiation is of great importance for a wide range of applications including flame sensing, environmental (ozone layer) monitoring, detection of biological/chemical agents, missile early warning systems, and secure intersatellite communication systems. These applications require high-performance UV photodetectors with low dark current, high responsivity, high detectivity, and fast time response. The widebandgap AlxGa1−xN ternary alloy is well-suited as a photodetector material for operation in the wavelength range of 200 nm to 365 nm. Its outstanding material properties (direct bandgap, tunable cut-off, allows heterostructures, intrinsically solar-blind) make AlxGa1−xN suitable for a variety of harsh environments. If properly constructed, AlxGa1−xN-based photodetectors could offer significant advantages over the older photomultiplier tube (PMT) technology in terms of size, cost, robustness, complexity, dark current, bandwidth, and solar-blind operation. The motivation behind this work is the need for high-performance, solid-state UV photodetectors that can be cost-effectively manufactured into high-density arrays. We have designed, fabricated, and characterized several visible/solar-blind AlxGa1−xN photodiode samples. With solar-blind AlxGa1−xN photodiode samples, we achieved excellent device performance in almost all aspects. Very low dark currents were measured with heterostructure AlxGa1−xN Schottky and p-i-n samples. The extremely low leakage characteristics resulted in record detectivity and noise performance. Detectivity performance comparable to PMT detectivity was achieved. True solar-blind operation (sub-280 nm cut-off) with high visible rejection was demonstrated. In addition, we improved the bandwidth performance of AlxGa1−xN-based solar-blind photodetectors by over an order of magnitude. Solar-blind Schottky, p-i-n, and metal-semiconductor-metal photodiode samples exhibited very fast pulse response with multi-GHz bandwidths.Item Open Access Hollow-cathode plasma-assisted atomic layer deposition: A novel route for low-temperature synthesis of crystalline III-nitride thin films and nanostructures(IEEE, 2015) Bıyıklı, Necmi; Ozgit-Akgun, Çağla; Goldenberg, Eda; Haider, Ali; Kızır, Seda; Uyar, Tamer; Bolat, Sami; Tekcan, Burak; Okyay, Ali KemalHollow cathode plasma-assisted atomic layer deposition is a promising technique for obtaining III-nitride thin films with low impurity concentrations at low temperatures. Here we report our efforts on the development of HCPA-ALD processes for III-nitrides together with the properties of resulting thin films and nanostructures. The content will further include nylon 6,6/GaN core/shell and BN/AlN bishell hollow nanofibers, proof-of-concept thin film transistors and UV photodetectors fabricated using HCPA-ALD-grown GaN layers, as well as early results for InN thin films deposited by HCPA-ALD technique. © 2015 IEEE.Item Open Access On the hole accelerator for III-nitride light-emitting diodes(American Institute of Physics Inc., 2016) Zhang Z.-H.; Zhang, Y.; Bi, W.; Geng, C.; Xu S.; Demir, Hilmi Volkan; Sun, X. W.In this work, we systematically conduct parametric studies revealing the sensitivity of the hole injection on the hole accelerator (a hole accelerator is made of the polarization mismatched p-electron blocking layer (EBL)/p-GaN/p-AlxGa1-xN heterojunction) with different designs, including the AlN composition in the p-AlxGa1-xN layer, and the thickness for the p-GaN layer and the p-AlxGa1-xN layer. According to our findings, the energy that the holes obtain does not monotonically increase as the AlN incorporation in the p-AlxGa1-xN layer increases. Meanwhile, with p-GaN layer or p-AlxGa1-xN layer thickening, the energy that the holes gain increases and then reaches a saturation level. Thus, the hole injection efficiency and the device efficiency are very sensitive to the p-EBL/p-GaN/p-AlxGa1-xN design, and the hole accelerator can effectively increase the hole injection if properly designed.