Browsing by Keywords "Material removal rate"

Now showing items 1-2 of 2

    • 83 W, 1 ns, 3.1 MHz all-fiber laser for micromachining 

      Özgören, Kıvanç; Öktem, Bülent; Yılmaz, Sinem; İlday, F. Ömer; Pasin, E.; Eken, K. (IEEE, 2011)
      Fiber lasers are commonly used for various material processing applications. The advantages (such as simplicity of the system, high material removal rate) and disadvantages (larger heat-affected zone, reduced precision) ...

    • Non-thermal material and tissue processing with 100 MHz and 500 MHz repetition rate bursts 

      Kerse, Can; Kalaycıoğlu, Hamit; Akaalan O.; Eldeniz, Y.B.; İlday, F. Ömer; Hoogland H.; Holzwarth, R. (IEEE, 2013)
      There are a number of applications that would avail a pulse pattern in the form of closely grouped and uniformly spaced pulses, i.e., bursts [1]. Closely grouped pulses with pulse to pulse separation in the order of a few ...