Browsing by Keywords "Data mapping"

Now showing items 1-2 of 2

    • Reliability-aware 3D chip multiprocessor design 

      Öztürk, Özcan; Aktürk, İsmail (IEEE, 2012-06)
      Ability to stack separate chips in a single package enables three-dimensional integrated circuits (3D ICs). Heterogeneous 3D ICs provide even better opportunities to reduce the power and increase the performance per unit ...

    • Reliability-aware heterogeneous 3D chip multiprocessor design 

      Akturk, I.; Ozturk, O. (Springer, 2013)
      Ability to stack separate chips in a single package enables three-dimensional integrated circuits (3D ICs). Heterogeneous 3D ICs provide even better opportunities to reduce the power and increase the performance per unit ...