Now showing items 1-3 of 3

    • Intimate monolithic integration of chip-scale photonic circuits 

      Sabnis, V. A.; Demir, Hilmi Volkan; Fidaner, O.; Zheng, J.-F.; Harris, J. S.; Miller, D. A. B.; Li, N.; Wu, T.-C.; Chen, H.-T.; Houng, Y.-M. (IEEE, 2005)
      In this paper, we introduce a robust monolithic integration technique for fabricating photonic integrated circuits comprising optoelectronic devices (e.g., surface-illuminated photodetectors, waveguide quantum-well modulators, ...
    • Multifunctional integrated photonic switches 

      Demir, H. M.; Sabnis, V. A.; Fidaner, O.; Zheng, J.-F.; Harris, J. S.; Miller, D. A. B. (Institute of Electrical and Electronics Engineers, 2005)
      Traditional optical-electronic-optical (o-e-o) conversion in today’s optical networks requires cascading separately packaged electronic and optoelectronic chips and propagating high-speed electrical signals through and ...
    • Self-aligning planarization and passivation for integration applications in III-V semiconductor devices 

      Demir, Hilmi Volkan; Zheng, J.-F.; Sabnis, V. A.; Fidaner, O.; Hanberg, J.; Harris, J. S.; Miller, D. A. B. (IEEE, 2005)
      This paper reports an easy planarization and passivation approach for the integration of III-V semiconductor devices. Vertically etched III-V semiconductor devices typically require sidewall passivation to suppress leakage ...