Bolat, S.Ozgit Akgun, C.Tekcan, B.Bıyıklı, NecmiOkyay, Ali Kemal2015-07-282015-07-2820140003-6951http://hdl.handle.net/11693/12762We report GaN thin film transistors (TFT) with a thermal budget below 250 °C. GaN thin films are grown at 200 °C by hollow cathode plasma-assisted atomic layer deposition (HCPA-ALD). HCPA-ALD-based GaN thin films are found to have a polycrystalline wurtzite structure with an average crystallite size of 9.3 nm. TFTs with bottom gate configuration are fabricated with HCPA-ALD grown GaN channel layers. Fabricated TFTs exhibit n-type field effect characteristics. N-channel GaN TFTs demonstrated on-to-off ratios (ION/I OFF) of 103 and sub-threshold swing of 3.3 V/decade. The entire TFT device fabrication process temperature is below 250 °C, which is the lowest process temperature reported for GaN based transistors, so far. © 2014 AIP Publishing LLC.EnglishAtomic Layer DepositionBudget ControlCathodesDepositionGallium NitridePulsed Laser DepositionThin FilmsZinc SulfideArticle10.1063/1.4884061