Turut, A.Karabulut, A.Ejderha, K.Bıyıklı, Necmi2016-02-082016-02-0820152053-1591http://hdl.handle.net/11693/22181High-k Al2O3 with metallic oxide thickness of about 3 nmon n-type GaAs substrate has been deposited by the atomic layer deposition (ALD) technique. Thus, it has been formed the Au-Ti/Al2O3/n-GaAs MIS structures. It has been seen that the MIS structure exhibits excellent capacitance-voltage (C-V) and current-voltage (I-V) properties at 300 K. The saturation current of the forward bias and reverse bias I-V characteristics was the same value. An ideality factor value of 1.10 has been obtained from the forward bias I-V characteristics. The C-Vcharacteristics of the structure have shown almost no hysteresis from +3 Vto -10 Vwith frequency as a parameter. The reverse biasC-V curves have exhibited a behavior without frequency dispersion and almost hysteresis at each frequency from 10 kHz to 1000 kHz.EnglishAtomic layer dedepositionHigh dielectric materialMIS devicesCapacitance-conductance characteristics of Au/Ti/Al2O3/n-GaAs structures with very thin Al2O3 interfacial layerArticle10.1088/2053-1591/2/4/046301