Özaktaş, Haldun M.Erden, M. F.2015-07-282015-07-281999-12-100003-6935http://hdl.handle.net/11693/11129Several approaches to three-dimensional integration of conventional electronic circuits have been pursued recently. To determine whether the advantages of optical interconnections are negated by these advances, we compare the limitations of fully three-dimensional systems interconnected with optical, normally conducting, repeatered normally conducting, and superconducting interconnections by showing how system-level parameters such as signal delay, bandwidth, and number of computing elements are related. In particular, we show that the duty ratio of pulses transmitted on terminated transmission lines is an important optimization parameter that can be used to trade off signal delay and bandwidth so as to optimize applicable measures of performance or cost, such as minimum message delay in parallel computation.EnglishOptimal foundation architectureSystem sizeSiliconGrowthComparison of fully three-dimensional optical, normally conducting, and superconducting interconnectionsArticle10.1364/AO.38.007264