Integration of through-wafer interconnects with a two-dimensional cantilever array

Chow, E. M.Soh, H. T.Lee, H. C.Adams, J. D.Minne, S. C.Yaralioglu, G. G.Atalar, AbdullahQuate, C. F.Kenny, T. W.2015-07-282015-07-282000-05-220924-4247http://hdl.handle.net/11693/13505High-density through-wafer interconnects are incorporated in a two-dimensional (2D) micromachined cantilever array. The design addresses alignment and density issues associated with 2D arrays. Each cantilever has piezoresistive deflection sensors and high-aspect ratio silicon tips. The fabrication process and array operation are described. The integration of cantilevers, tips, and interconnects enables operation of a high-density 2D scanning probe array over large areas.EnglishSensor ArrayScanning probe microscopeThrough-wafer electrical ınterconnectPiezoresistive silicon cantileverIntegration of through-wafer interconnects with a two-dimensional cantilever arrayArticle10.1016/S0924-4247(99)00381-7