Hosseini-Pishrobat, MehranTatar, Erdinç2025-02-222025-02-222024-04-232377-3480https://hdl.handle.net/11693/116620Conference Name:2024 IEEE international symposium on inertial sensors and systems, inertialDate of Conference: March 25-28, 2024We report on experimental and analytical investigation of temperature effects in a 3.2mm-diameter, 57kHz ring gyroscope equipped with 16 capacitive stress sensors. According to the well-known ~-60ppm/°C temperature dependency of Young’s modulus of silicon, the temperature coefficient of frequency (TCF) is expected to be ~-30ppm/°C. Our experimentally observed TCFs, however, tend to be ~-14ppm/°C, pointing to thermal stresses as the countering factor. To find the root cause of the measured TCFs, we develop an analytical framework that enables us to calculate the temperature-induced stiffness variations, considering both thermal and mechanical strains. The model successfully predicts changes and hysteretic behavior of frequency over temperature using the measured stress and temperature data.EnglishModelingRing gyroscopeTemperature coefficient of frequencyThermal stressesConference Paper10.1109/INERTIAL60399.2024.10502078979-8-3503-1669-8