Veske, TolgaErkan, DerinTatar, Erdinc2024-03-042024-03-042023-01978-1-6654-9309-31084-6999https://hdl.handle.net/11693/114339Date of Conference: 15-19 January 2023Conference Name: 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS)This paper presents a high-resolution capacitive stress sensor array to precisely characterize the distributed MEMS packaging stress, for the first time. The unit stress measurement cell utilizes a bridge-type mechanical amplifier that converts the substrate strain into capacitance variations. We have measured and compared the MEMS die stress over temperature for different die attaches with a custom designed PCB housing an on-chip heater. The proposed approach significantly simplifies the evaluation and selection of packaging materials. Comparing the temperature responses of a soft silicone-based and stiffer silver-filled epoxy reveals difficult to predict results.enPackaging stressDie-attachCapacitive stress sensorConference Paper10.1109/MEMS49605.2023.10052529978-1-6654-9308-62160-1968