Zhu B.Tan S.T.Liu W.Lu S.Zhang, Y.Chen, S.Hasanov N.Kang, X.Demir, Hilmi Volkan2018-04-122018-04-1220161943-0655http://hdl.handle.net/11693/36523We report the improved performance of InGaN/GaN-based light-emitting diodes (LEDs) through the design and the formation of the InGaxNyOz interfacial layer, which maintains high reflectivity of silver and forms good ohmic contact between pristine silver and p-GaN. The interfacial layer was designed and formed by depositing a thin layer of indium tin oxide (ITO) on top of p-GaN, followed by thermal annealing, to enable the interdiffusion and the intermixing of In, Sn, Ga, O, and N atoms. Both electrical and optical performances of the LED with the optimized InGaxNyOz interfacial layer are improved, thus achieving the highest wall-plug efficiency, compared with those LEDs with and without ITO layers at operation current.EnglishInGaxNyOz interfacial layerOhmic contactIndium tin oxide (ITO)Light emitting diodes (LED)Modulating ohmic contact through InGaxNyOz interfacial layer for high-performance InGaN/GaN-based light-emitting diodesArticle10.1109/JPHOT.2016.2570422