Altuntas, H.Ozgit Akgun, C.Donmez, I.Bıyıklı, Necmi2016-02-082016-02-0820150021-8979http://hdl.handle.net/11693/23336Here, we report on the current transport mechanisms in AlN thin films deposited at a low temperature (i.e., 200°C) on p-type Si substrates by plasma-enhanced atomic layer deposition. Structural characterization of the deposited AlN was carried out using grazing-incidence X-ray diffraction, revealing polycrystalline films with a wurtzite (hexagonal) structure. Al/AlN/ p-Si metal-insulator-semiconductor (MIS) capacitor structures were fabricated and investigated under negative bias by performing current-voltage measurements. As a function of the applied electric field, different types of current transport mechanisms were observed; i.e., ohmic conduction (15.2-21.5 MV/m), Schottky emission (23.6-39.5 MV/m), Frenkel-Poole emission (63.8-211.8 MV/m), trap-assisted tunneling (226-280 MV/m), and Fowler-Nordheim tunneling (290-447 MV/m). Electrical properties of the insulating AlN layer and the fabricated Al/AlN/p-Si MIS capacitor structure such as dielectric constant, flat-band voltage, effective charge density, and threshold voltage were also determined from the capacitance-voltage measurements.EnglishAluminumAtomic layer depositionCapacitorsElectric fieldsMetal insulator boundariesMIS devicesMOS capacitorsSemiconducting siliconSiliconTemperatureThin filmsThreshold voltageVoltage measurementX ray diffractionZinc sulfideCapacitance voltage measurementsCurrent transport mechanismCurrent voltage measurementGrazing incidence X-ray diffractionMetal insulator semiconductor capacitorsPlasma-enhanced atomic layer depositionStructural characterizationTrap assisted tunnelingDepositionArticle10.1063/1.4917567