Browsing by Author "Hasanov N."

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    Advantages of the Blue InGaN/GaN Light-Emitting Diodes with an AlGaN/GaN/AlGaN Quantum Well Structured Electron Blocking Layer
    (American Chemical Society, 2014-03-21) Ju, Z. G.; Liu W.; Zhang Z.-H.; Tan S.T.; Ji Y.; Kyaw, Z.; Zhang, X. L.; Lu, S. P.; Zhang, Y. P.; Zhu B.; Hasanov N.; Sun, X. W.; Demir, Hilmi Volkan
    InGaN/GaN light-emitting diodes (LEDs) with p-(AlGaN/GaN/AlGaN) quantum well structured electron blocking layer (QWEBL) are designed and grown by a metal− organic chemical-vapor deposition (MOCVD) system. The proposed QWEBL LED structure, in which a p-GaN QW layer is inserted in the p-AlGaN electron blocking layer, not only leads to an improved hole injection but also reduces the electron leakage, thus enhancing the radiative recombination rates across the active region. Consequently, the light output power was enhanced by 10% for the QWEBL LED at a current density of 35 A/cm2. The efficiency droop of the optimized device was reduced to 16%. This is much smaller than that of the conventional p-AlGaN electron blocking layer LED, which is 31%.
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    Critical role of CdSe nanoplatelets in color-converting CdSe/ZnS nanocrystals for InGaN/GaN light-emitting diodes
    (OSA - The Optical Society, 2016) Hasanov N.; Sharma, V. K.; Martinez, P. L. H.; Tan S.T.; Demir, Hilmi Volkan
    Here we report CdSe nanoplatelets that are incorporated into color-converting CdSe/ZnS nanocrystals for InGaN/GaN light-emitting diodes. The critical role of CdSe nanoplatelets as an exciton donor for the color conversion was experimentally investigated. The power conversion efficiency of the hybrid light-emitting diode was found to increase by 23% with the incorporation of the CdSe nanoplatelets. The performance enhancement is ascribed to efficient exciton transfer from the donor CdSe nanoplatelet quantum wells to the acceptor CdSe/ZnS nanocrystal quantum dots through F�rster-type nonradiative resonance energy transfer.
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    Decoupling contact and mirror: an effective way to improve the reflector for flip-chip InGaN/GaN-based light-emitting diodes
    (Institute of Physics Publishing, 2016) Zhu B.; Liu W.; Lu S.; Zhang, Y.; Hasanov N.; Zhang X.; Ji Y.; Zhang Z.-H.; Tan S.T.; Liu, H.; Demir, Hilmi Volkan
    In the conventional fabrication process of the widely-adopted Ni/Ag/Ti/Au reflector for InGaN/GaN-based flip-chip light-emitting diodes (LEDs), the contact and the mirror are entangled together with contrary processing conditions which set constraints to the device performance severely. Here we first report the concept and its effectiveness of decoupling the contact formation and the mirror construction. The ohmic contact is first formed by depositing and annealing an extremely thin layer of Ni/Ag on top of p-GaN. The mirror construction is then carried out by depositing thick layer of Ag/Ti/Au without any annealing. Compared with the conventional fabrication method of the reflector, by which the whole stack of Ni/Ag/Ti/Au is deposited and annealed together, the optical output power is improved by more than 70% at 350 mA without compromising the electrical performance. The mechanism of decoupling the contact and the mirror is analyzed with the assistance of contactless sheet resistance measurement and secondary ion mass spectrometry (SIMS) depth profile analysis. © 2016 IOP Publishing Ltd.
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    Enhanced hole transport in InGaN/GaN multiple quantum well light-emitting diodes with a p-type doped quantum barrier
    (Optical Society of America, 2013) Ji Y.; Zhang, Z. -H.; Tan S.T.; Ju, Z. G.; Kyaw, Z.; Hasanov N.; Liu W.; Sun X. W.; Demir, Hilmi Volkan
    We study hole transport behavior of InGaN/GaN light-emitting diodes with the dual wavelength emission method. It is found that at low injection levels, light emission is mainly from quantum wells near p-GaN, indicating that hole transport depth is limited in the active region. Emission from deeper wells only occurs under high current injection. However, with Mg-doped quantum barriers, holes penetrate deeper within the active region even under low injection, increasing the radiative recombination. Moreover, the improved hole transport leads to reduced forward voltage and enhanced light generation. This is also verified by numerical analysis of hole distribution and energy band structure. © 2013 Optical Society of America.
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    Improving hole injection efficiency by manipulating the hole transport mechanism through p-type electron blocking layer engineering
    (Optical Society of America, 2014) Zhang, Zi-Hui; Ju, Z.; Liu W.; Tan S.T.; Ji Y.; Kyaw, Z.; Zhang X.; Hasanov N.; Sun, X. W.; Demir, Hilmi Volkan
    The p-type AlGaN electron blocking layer (EBL) is widely used in InGaN/GaN light-emitting diodes (LEDs) for electron overflow suppression. However, a typical EBL also reduces the hole injection efficiency, because holes have to climb over the energy barrier generated at the p-AlGaN/p-GaN interface before entering the quantum wells. In this work, to address this problem, we report the enhancement of hole injection efficiency by manipulating the hole transport mechanism through insertion of a thin GaN layer of 1 nm into the p-AlGaN EBL and propose an AlGaN/GaN/AlGaN-type EBL outperforming conventional AlGaN EBLs. Here, the position of the inserted thin GaN layer relative to the p-GaN region is found to be the key to enhancing the hole injection efficiency. InGaN/ GaN LEDs with the proposed p-type AlGaN/GaN/AlGaN EBL have demonstrated substantially higher optical output power and external quantum efficiency.
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    InGaN/GaN light-emitting diode with a polarization tunnel junction
    (American Institute of Physics, 2013) Zhang Z.-H.; Tan S.T.; Kyaw, Z.; Ji Y.; Liu W.; Ju, Z.; Hasanov N.; Sun, X. W.; Demir, Hilmi Volkan
    We report InGaN/GaN light-emitting diodes (LED) comprising in situ integrated p(+)-GaN/InGaN/n(+)-GaN polarization tunnel junctions. Improved current spreading and carrier tunneling probability were obtained in the proposed device architecture, leading to the enhanced optical output power and external quantum efficiency. Compared to the reference InGaN/GaN LEDs using the conventional p(+)/n(+) tunnel junction, these devices having the polarization tunnel junction show a reduced forward bias, which is attributed to the polarization induced electric fields resulting from the in-plane biaxial compressive strain in the thin InGaN layer sandwiched between the p(+)-GaN and n(+)-GaN layers. (C) 2013 AIP Publishing LLC.
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    Modulating ohmic contact through InGaxNyOz interfacial layer for high-performance InGaN/GaN-based light-emitting diodes
    (Institute of Electrical and Electronics Engineers Inc., 2016) Zhu B.; Tan S.T.; Liu W.; Lu S.; Zhang, Y.; Chen, S.; Hasanov N.; Kang, X.; Demir, Hilmi Volkan
    We report the improved performance of InGaN/GaN-based light-emitting diodes (LEDs) through the design and the formation of the InGaxNyOz interfacial layer, which maintains high reflectivity of silver and forms good ohmic contact between pristine silver and p-GaN. The interfacial layer was designed and formed by depositing a thin layer of indium tin oxide (ITO) on top of p-GaN, followed by thermal annealing, to enable the interdiffusion and the intermixing of In, Sn, Ga, O, and N atoms. Both electrical and optical performances of the LED with the optimized InGaxNyOz interfacial layer are improved, thus achieving the highest wall-plug efficiency, compared with those LEDs with and without ITO layers at operation current.
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    On the origin of the electron blocking effect by an n-type AlGaN electron blocking layer
    (AIP Publishing, 2014) Zhang Z.-H.; Ji Y.; Liu W.; Tan S.T.; Kyaw, Z.; Ju, Z.; Zhang X.; Hasanov N.; Lu S.; Zhang, Y.; Zhu B.; Sun, X. W.; Demir, Hilmi Volkan
    In this work, the origin of electron blocking effect of n-type Al 0.25Ga0.75N electron blocking layer (EBL) for c+ InGaN/GaN light-emitting diodes has been investigated through dual-wavelength emission method. It is found that the strong polarization induced electric field within the n-EBL reduces the thermal velocity and correspondingly the mean free path of the hot electrons. As a result, the electron capture efficiency of the multiple quantum wells is enhanced, which significantly reduces the electron overflow from the active region and increases the radiative recombination rate with holes. © 2014 AIP Publishing LLC.
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    Simultaneous enhancement of electron overflow reduction and hole injection promotion by tailoring the last quantum barrier in InGaN/GaN light-emitting diodes
    (AIP Publishing, 2014-04-24) Kyaw, Z.; Zhang Z.-H.; Liu W.; Tan S.T.; Ju, Z. G.; Zhang, X. L.; Ji Y.; Hasanov N.; Zhu B.; Lu S.; Zhang, Y.; Teng, J. H.; Wei, S. X.; Demir, Hilmi Volkan
    A three-step graded undoped-InGaN layers embedded between the GaN last quantum barrier layer and the p-AlGaN electron blocking layer was proposed and its effect on the performance of InGaN/GaN light-emitting diodes was investigated both experimentally and theoretically. In the proposed structure, the electron leakage is found to be effectively reduced, while the hole injection efficiency is simultaneously increased significantly, hence enabling a greatly enhanced radiative recombination rate within the active region. As a result, improvements of 12.25% in the optical output power and 11.98% in the external quantum efficiency are obtained from the proposed device with the respect to the reference device.