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dc.contributor.authorSantoni, B. G.en_US
dc.contributor.authorMelik, R.en_US
dc.contributor.authorÜnal, Emreen_US
dc.contributor.authorPerkgöz, N. K.en_US
dc.contributor.authorKamstock, D. A.en_US
dc.contributor.authorRyan, S. D.en_US
dc.contributor.authorDernell W. S.en_US
dc.contributor.authorDemir, Hilmi Volkanen_US
dc.contributor.authorPuttlitz, C. M.en_US
dc.date.accessioned2016-02-08T12:26:12Z
dc.date.available2016-02-08T12:26:12Z
dc.date.issued2009-06en_US
dc.identifier.urihttp://hdl.handle.net/11693/28649
dc.descriptionDate of Conference: 17-21 June , 2009
dc.descriptionConference name: Proceedings of the ASME 2009 Summer Bioengineering Conference
dc.description.abstractOrthopaedic extremity injuries present a large medical and financial burden to the United States and world-wide communities [1]. Approximately six million long bone fractures are reported annually in the United States and approximately 10% of these fractures do not heal properly. Though the exact mechanism of impaired healing is poorly understood, many of these non-unions result when there is a communited condition that does not proceed through a stabilized healing pathway [2]. Currently, clinicians may monitor healing visually by radiographs, or via manual manipulation of the bone at the fracture [3]. Unfortunately, the course of aberrant fracture healing is not easily diagnosed in the early period when standard radiographic information of the fracture is not capable of discriminating the healing pathway. Manual assessment of fracture healing is also an inadequate diagnostic tool in the early stages of healing [4].en_US
dc.language.isoEnglishen_US
dc.source.titleProceedings of the ASME Summer Bioengineering Conference 2009, SBC2009en_US
dc.relation.isversionofhttp://dx.doi.org/10.1115/SBC2009-206670en_US
dc.titleDevelopment and biocompatibility characterization of a biomems sensor for monitoring the progression of fracture healingen_US
dc.typeConference Paperen_US
dc.departmentDepartment of Physicsen_US
dc.departmentDepartment of Electrical and Electronics Engineeringen_US
dc.departmentInstitute of Materials Science and Nanotechnology (UNAM)en_US
dc.citation.spage23en_US
dc.citation.epage24en_US
dc.identifier.doi10.1115/SBC2009-206670en_US
dc.contributor.bilkentauthorDemir, Hilmi Volkan
buir.contributor.orcidDemir, Hilmi Volkan|0000-0003-1793-112Xen_US


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