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dc.contributor.authorNaughton, T.J.en_US
dc.contributor.authorKreis, T.en_US
dc.contributor.authorOnural L.en_US
dc.contributor.authorFerraro P.en_US
dc.contributor.authorDepeursinge, C.en_US
dc.contributor.authorEmery, Y.en_US
dc.contributor.authorHennelly, B.M.en_US
dc.contributor.authorKujawiñska, M.en_US
dc.date.accessioned2016-02-08T11:34:27Z
dc.date.available2016-02-08T11:34:27Z
dc.date.issued2009en_US
dc.identifier.issn0277786X
dc.identifier.urihttp://hdl.handle.net/11693/26740
dc.description.abstractIn digital holography, holograms are usually optically captured and then two-dimensional slices of the reconstruction volume are reconstructed by computer and displayed on a two-dimensional display. When the recording is of a three-dimensional scene then such two-dimensional display becomes restrictive. We outline our progress on capturing larger ranges of perspectives of three-dimensional scenes, and our progress on four approaches to better visualise this three-dimensional information encoded in the digital holograms. The research has been performed within a European Commission funded research project dedicated the capture, processing, transmission, and display of real-world 3D and 4D scenes using digital holography. © 2009 SPIE.en_US
dc.language.isoEnglishen_US
dc.source.titleProceedings of SPIE - The International Society for Optical Engineeringen_US
dc.relation.isversionofhttp://dx.doi.org/10.1117/12.821866en_US
dc.subjectDigital hologramsen_US
dc.subjectDigital holographyen_US
dc.subjectEuropean Commissionen_US
dc.subjectReal-worlden_US
dc.subjectThree-dimensional displayen_US
dc.subjectThree-dimensional informationen_US
dc.subjectThree-dimensional scenesen_US
dc.subjectComputer generated holographyen_US
dc.subjectHologramsen_US
dc.subjectHolographic interferometryen_US
dc.subjectImaging systemsen_US
dc.subjectIndustrial researchen_US
dc.subjectTwo dimensionalen_US
dc.subjectVisualizationen_US
dc.subjectThree dimensionalen_US
dc.titleProcessing of optically-captured digital holograms for three-dimensional displayen_US
dc.typeConference Paperen_US
dc.departmentDepartment of Electrical and Electronics Engineering
dc.citation.volumeNumber7329en_US
dc.identifier.doi10.1117/12.821866en_US


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