Injection molding of polymeric microfluidic devices
Author
Koska, Arif Koray
Advisor
Çetin, Barbaros
Date
2013Publisher
Bilkent University
Language
English
Type
ThesisItem Usage Stats
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Abstract
Mass-production of microfluidic devices is important for fields in which disposable
devices are widely used such as clinical diagnostic and biotechnology. Injection
molding is a well-known, promising process for the production of devices on a
mass-scale at low-cost. The major objective of this study is to develop a technique
for repeatable, productive and accurate fabrication of integrated microfluidic
devices on a mass production scale. To achieve this, injection molding process
is adapted for the fabrication of a microfluidic device with a single microchannel.
During the design procedure, numerical experimentation was performed
using Moldflow® simulation tool. To increase the product quality, high-precision
mechanical machining is utilized for the manufacturing of the mold of the microfluidic
device. A conventional injection molding machine is implemented for
the injection molding process of the microfluidic device. Injection molding is
performed at different mold temperatures. The warpage of the injected pieces is
characterized by measuring the part deformation. The effect of the mold temperature
on the quality of the final device is assessed in terms of part deformation and
the bonding quality. From the experimental results, one-to-one correspondence
between the warpage and the bonding quality of the molded pieces is observed.
As the warpage of the pieces decresases, the bonding quality increases. A maximum
point for the breaking pressure of the bonding and the minimum point for
the warpage was found at the same mold temperature. This mold temperature
was named as the optimum temperature for designed microfluidic device. The
experimental results are also used to discuss the assessment of the simulation
results. It was observed that although Moldflow® can predict many aspects of
the process, all the physics of the injection molding process cannot be covered.
Keywords
Polymeric disposable devicesmicrofluidics
injection molding
warpage characterization
direct bonding